许琳琳

Ø 个人简介

许琳琳，女，中共党员，博士，武汉纺织大学微电子学院讲师，华中科技大学与武汉纺织大学联合培养博士后。主要从事航天级深紫外LED光学热学性能调控与高可靠封装研究，研究内容包括深紫外LED发光效率提升机理、器件散热增强机制、全无机气密封装方法、航天级可靠性分析等，取得了一系列创新性成果，发表相关SCI论文10余篇，其中第一作者发表SCI论文3篇，申请或授权专利5项。参与国家重点研发计划2项，参与国家自然科学基金面上项目3项。多次参加大学生创新创业大赛并获得全国银奖、湖北省金奖。

办公地点：崇真楼南楼A2046

电子邮箱：linlinxu@wtu.edu.cn

Ø 教育经历

2016.09-2025.06     华中科技大学  武汉光电国家研究中心  光学工程  博士研究生 （硕博连读）

Ø 工作经历

2026.03-至今         武汉纺织大学微电子学院    讲师

Ø 研究方向

航天级深紫外LED可靠性研究、宽禁带半导体器件封装

Ø 代表性成果

1. Linlin Xu, Yang Peng, Feng Wu, Wei Guo*, Jiangnan Dai and Changqing Chen*,” Enhanced efficiency and reliability of AlGaN UVC-LED with tapered hole injection layer”, Micromachines, 2025, 16(12): 1376.

2. Linlin Xu, Jin Xu, Wei Zhang*, Renli Liang, Jiahui Hu, Hanling Long, Jiangnan Dai and Changqing Chen, “High-stability reflective bonding pads for GaN-based flip-chip light-emitting diodes packaged by reflow soldering”, Journal of Physics D-Applied Physics, 2019, 52(26):265102.

3. Linlin Xu, Renli Liang , Jiangnan Dai , Hanling Long, Shuai Wang, Jingwen Chen, Jintong Xu, Xiangyang Li and Changqing Chen*, “Reduction of Structural Thermal Resistance for Deep Ultraviolet Light-Emitting Diodes Fabricated on AlN Ceramic Substrate via Copper-Filled Thermal Holes”, IEEE Transactions on Components Packaging and Manufacturing Technology, 2018, 8(12): 2107-2112.

4. Linlin Xu, Renli Liang, Hanling Long, Jiangnan Dai and Changqing Chen*, “Investigation on Thermal Characteristics and Fabrication of DUV-LEDs Using Copper Filled Thermal Hole”, Proceedings of the 18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, CHINA, 2017.

5. Lin Luo, Linlin Xu, Jiuzhou Zhao, Renli Liang, Zhengchen Li, Yang Peng*, Xinzhong Wang, Jiangnan Dai and Mingxiang Chen*, “All-Inorganic Hermetic Packaging of Deep-Ultraviolet Light-Emitting Diodes Through Laser Localized Heating and Welding“, IEEE Transactions on Electron Devices, 2024, 71(9): 5535-5540.

6. Yongjie Ding, Linlin Xu, Qing Wang, Renli Liang, Yang Peng*, Xinzhong Wang, Jiangnan Dai and Mingxiang Chen*, “Heat Dissipation Enhancement of High-Power Deep-Ultraviolet LEDs Through Plated Copper on Thick Film Diamond Substrates”, IEEE Electron Device Letters, 2024, 45(9): 1634-1637.

7. Zhihua Zheng, Zhongshu Xiong, Linlin Xu, Feng Wu*, Jintong Xu, Jiangnan Dai and Changqing Chen*, “Interface-Embedded Pt-Plasmons Enhanced Self-Powered Deep-UV Photodetector”, IEEE Electron Device Letters, 2024, 45(4): 633-636.

8. Yi Zhang, Shuang Zhang, Linlin Xu, Huixue Zhang, Ange Wang, Maocheng Shan, Zhihua Zheng, Hao Wang, Feng Wu, Jiangnan Dai* and Changqing Chen*, “Full wafer scale electroluminescence properties of AlGaN-based deep ultraviolet LEDs with different well widths”, Optics Letters, 2021, 46(9): 2111-2114.

9. Renli Liang, Jiangnan Dai*, Linlin Xu, Yi Zhang, Ju He, Shuai Wang, Jingwen Chen, Yang Peng, Lei Ye*, Hao-chung Kuo* and Changqing Chen, “Interface Anchored Effect on Improving Working Stability of Deep Ultraviolet Light-Emitting Diode Using Graphene Oxide-Based Fluoropolymer Encapsulant”, ACS Applied Materials & Interfaces, 2018, 10(9): 8238-8244.

10. Renli Liang, Jiangnan Dai*, Linlin Xu, Ju He, Shuai Wang, Yang Peng, Hao Wang, Lei Ye* and Changqing Chen*, “High Light Extraction Efficiency of Deep Ultraviolet LEDs Enhanced Using Nanolens Arrays”, IEEE Transactions on Electron Devices, 2018, 65(6): 2498-2503.